{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11495565","patent":{"patent_number":"US-11495565","title":"Stacked semiconductor device and multiple chips used therein","assignee":null,"inventors":[],"filing_date":"2019-11-06T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A stacked semiconductor device encompasses a mother-substrate, rectangular chips mounted on the mother-substrate, and bump-connecting mechanisms connecting the mother-substrate and the chips by a non-provisional joint-process with a height lower than the height of a provisional joint-process jointing the mother-substrate and the chips. The mother-substrate has unit elements arranged in each of unit-element areas assigned to a first lattice defined on a first main surface of the mother-substrate, the first main surface is divided into chip-mounting areas along a second lattice having a smaller number of meshes than the first lattice. The bump-connecting mechanisms are arranged along a third lattice corresponding to the arrangement of the unit elements, and transmit signals from the unit elements independently to each of the circuits merged in the chips. After the provisional joint-process, the bump-connecting mechanisms can be separated into substrate-side and chip-side connection-elements."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked semiconductor device and multiple chips used therein","description":"A stacked semiconductor device encompasses a mother-substrate, rectangular chips mounted on the mother-substrate, and bump-connecting mechanisms connecting the mother-substrate and the chips by a non-","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11495565","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11495565","citation_suggestion":"Patentable. \"Stacked semiconductor device and multiple chips used therein\" (US-11495565). https://patentable.app/patents/US-11495565","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11495565","json":"https://patentable.app/api/llm-context/US-11495565","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:13:46.747Z"}