{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11495573","patent":{"patent_number":"US-11495573","title":"Package structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-03-02T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a first semiconductor die, a second semiconductor die, a redistribution circuit structure, and a semiconductor device. The redistribution circuit structure has a first surface and a second surface opposite to the first surface, where the first surface is in contact with the first semiconductor die and the second semiconductor die, and the redistribution circuit structure is disposed on and electrically connected to the first semiconductor die and the second semiconductor die. The redistribution circuit structure includes a recess extending from the second surface toward the first surface. The semiconductor device is located in the recess and electrically connected to the first semiconductor die and the second semiconductor die through the redistribution circuit structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and manufacturing method thereof","description":"A package structure includes a first semiconductor die, a second semiconductor die, a redistribution circuit structure, and a semiconductor device. The redistribution circuit structure has a first sur","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11495573","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11495573","citation_suggestion":"Patentable. \"Package structure and manufacturing method thereof\" (US-11495573). https://patentable.app/patents/US-11495573","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11495573","json":"https://patentable.app/api/llm-context/US-11495573","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:22:16.840Z"}