{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11496111","patent":{"patent_number":"US-11496111","title":"Methods of plasma dicing bulk acoustic wave components","assignee":null,"inventors":[],"filing_date":"2019-10-10T00:00:00.000Z","publication_date":"2022-11-08T00:00:00.000Z","cpc_codes":["H04B"],"num_claims":20,"abstract":"Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components"},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of plasma dicing bulk acoustic wave components","description":"Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer ca","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11496111","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11496111","citation_suggestion":"Patentable. \"Methods of plasma dicing bulk acoustic wave components\" (US-11496111). https://patentable.app/patents/US-11496111","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11496111","json":"https://patentable.app/api/llm-context/US-11496111","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:23:18.366Z"}