{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11499080","patent":{"patent_number":"US-11499080","title":"Thermal interface material, and preparation and application thereof","assignee":null,"inventors":[],"filing_date":"2018-05-08T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","B82Y"],"num_claims":10,"abstract":"This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material. The thermal interface material combines excellent thermal conductivity and compressibility; the preparation method has the characteristics of simple process, low costs, safety and environmental protection, and accordingly, the thermal interface material can effectively resolve the heat dissipation problem of electronic products."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal interface material, and preparation and application thereof","description":"This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11499080","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11499080","citation_suggestion":"Patentable. \"Thermal interface material, and preparation and application thereof\" (US-11499080). https://patentable.app/patents/US-11499080","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11499080","json":"https://patentable.app/api/llm-context/US-11499080","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:27:28.711Z"}