{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502006","patent":{"patent_number":"US-11502006","title":"Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure","assignee":null,"inventors":[],"filing_date":"2019-05-31T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":26,"abstract":"Some embodiments include an apparatus having a well region extending into a semiconductor substrate. A first conductive element is over the well region, and a second conductive element is over the first conductive element. A hole extends through the first conductive element. A connecting element extends from the second conductive element to the well region, and passes through the hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure","description":"Some embodiments include an apparatus having a well region extending into a semiconductor substrate. A first conductive element is over the well region, and a second conductive element is over the fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502006","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502006","citation_suggestion":"Patentable. \"Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure\" (US-11502006). https://patentable.app/patents/US-11502006","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502006","json":"https://patentable.app/api/llm-context/US-11502006","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:16:58.027Z"}