{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502019","patent":{"patent_number":"US-11502019","title":"Heat sink, heat dissipation apparatus, heat dissipation system, and communications device","assignee":null,"inventors":[],"filing_date":"2021-05-14T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat sink, heat dissipation apparatus, heat dissipation system, and communications device","description":"One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502019","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502019","citation_suggestion":"Patentable. \"Heat sink, heat dissipation apparatus, heat dissipation system, and communications device\" (US-11502019). https://patentable.app/patents/US-11502019","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502019","json":"https://patentable.app/api/llm-context/US-11502019","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:07:13.511Z"}