{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502024","patent":{"patent_number":"US-11502024","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-01-21T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first semiconductor element, a first redistribution layer, a second redistribution layer, and a conductive via. The first semiconductor element has a first active surface and a first back surface opposite to the first active surface. The first redistribution layer is disposed adjacent to the first back surface of the first semiconductor element. The second redistribution layer is disposed adjacent to the first active surface of the first semiconductor element. The conductive via is disposed between the first redistribution layer and the second redistribution layer, where the conductive via inclines inwardly from the second redistribution layer to the first redistribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first semiconductor element, a first redistribution layer, a second redi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502024","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502024","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-11502024). https://patentable.app/patents/US-11502024","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502024","json":"https://patentable.app/api/llm-context/US-11502024","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:51:53.063Z"}