{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502040","patent":{"patent_number":"US-11502040","title":"Package structure and semiconductor pacakge","assignee":null,"inventors":[],"filing_date":"2021-05-10T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a semiconductor die, a plurality of conductive features, a bridge structure, an underfill, via structures and an encapsulant. The conductive features are electrically connected to the semiconductor die, wherein the conductive features include a first group with planar top surfaces, and a second group with uneven top surfaces. The bridge structure is partially overlapped with the semiconductor die and electrically connected to the first group of the conductive feature. The underfill is covering and contacting the first group of the conductive features. The via structures are disposed on and overlapped with the semiconductor die and electrically connected to the second group of the conductive features. The encapsulant is covering and contacting the via structures and the second group of the conductive features."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and semiconductor pacakge","description":"A package structure includes a semiconductor die, a plurality of conductive features, a bridge structure, an underfill, via structures and an encapsulant. The conductive features are electrically conn","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502040","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502040","citation_suggestion":"Patentable. \"Package structure and semiconductor pacakge\" (US-11502040). https://patentable.app/patents/US-11502040","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502040","json":"https://patentable.app/api/llm-context/US-11502040","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:10:40.274Z"}