{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502047","patent":{"patent_number":"US-11502047","title":"Packaging techniques for backside mesh connectivity","assignee":null,"inventors":[],"filing_date":"2018-09-07T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","H01L","H04L","H04L","H04L","H01L","H01L","H01L","H01L","H01L","H04L"],"num_claims":9,"abstract":"The embodiments herein are directed to technologies for backside security meshes of semiconductor packages. One package includes a substrate having a first interconnect terminal of a first type and a second interconnect terminal of a second type. The package also includes a first security mesh structure disposed on a first side of an integrated circuit die and a conductive path coupled between the first interconnect terminal and the second interconnect terminal. The first security mesh structure is coupled to the first interconnect terminal and the second interconnect terminal being coupled to a terminal on a second side of the integrated circuit die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging techniques for backside mesh connectivity","description":"The embodiments herein are directed to technologies for backside security meshes of semiconductor packages. One package includes a substrate having a first interconnect terminal of a first type and a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502047","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502047","citation_suggestion":"Patentable. \"Packaging techniques for backside mesh connectivity\" (US-11502047). https://patentable.app/patents/US-11502047","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502047","json":"https://patentable.app/api/llm-context/US-11502047","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:01:00.779Z"}