{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11502051","patent":{"patent_number":"US-11502051","title":"Semiconductor chip including through electrode, and semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2021-02-09T00:00:00.000Z","publication_date":"2022-11-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":26,"abstract":"A semiconductor chip includes a body portion with a front surface and a rear surface; a through electrode penetrating the body portion; a wiring portion that is disposed over the front surface of the body portion; a rear connection electrode that is disposed over the rear surface of the body portion; and a front connection electrode that is disposed over the wiring portion, wherein the rear connection electrode includes a power rear connection electrode that is simultaneously connected to two or more power through electrodes, and wherein a width of the power rear connection electrode is greater than a width of the front connection electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip including through electrode, and semiconductor package including the same","description":"A semiconductor chip includes a body portion with a front surface and a rear surface; a through electrode penetrating the body portion; a wiring portion that is disposed over the front surface of the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11502051","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11502051","citation_suggestion":"Patentable. \"Semiconductor chip including through electrode, and semiconductor package including the same\" (US-11502051). https://patentable.app/patents/US-11502051","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11502051","json":"https://patentable.app/api/llm-context/US-11502051","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:56:14.011Z"}