{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11504959","patent":{"patent_number":"US-11504959","title":"Method of material transfer","assignee":null,"inventors":[],"filing_date":"2020-01-24T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":14,"abstract":"A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises disposing an adhesion layer at the donor substrate or at the target substrate. The method further comprises bringing the target substrate and the donor substrate together. Further, the method comprises bonding together the donor substrate, the adhesion layer and the target substrate and removing the donor substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of material transfer","description":"A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises di","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11504959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11504959","citation_suggestion":"Patentable. \"Method of material transfer\" (US-11504959). https://patentable.app/patents/US-11504959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11504959","json":"https://patentable.app/api/llm-context/US-11504959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:26:05.989Z"}