{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508575","patent":{"patent_number":"US-11508575","title":"Low warp fan-out processing method and production of substrates therefor","assignee":null,"inventors":[],"filing_date":"2020-06-30T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":24,"abstract":"A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Low warp fan-out processing method and production of substrates therefor","description":"A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a cor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508575","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508575","citation_suggestion":"Patentable. \"Low warp fan-out processing method and production of substrates therefor\" (US-11508575). https://patentable.app/patents/US-11508575","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508575","json":"https://patentable.app/api/llm-context/US-11508575","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:24:23.783Z"}