{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508636","patent":{"patent_number":"US-11508636","title":"Multi-layer solution based deposition of dielectrics for advanced substrate architectures","assignee":null,"inventors":[],"filing_date":"2018-06-29T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed over the substrate. In an embodiment, a bilayer build-up layer is formed over the plurality of conductive features. In an embodiment, the bilayer build-up layer comprises a first dielectric layer and a second dielectric layer. In an embodiment, a surface of the first dielectric layer comprises depressions. In an embodiment, the second dielectric layer is disposed in the depressions of the surface of the first dielectric layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer solution based deposition of dielectrics for advanced substrate architectures","description":"Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed ov","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508636","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508636","citation_suggestion":"Patentable. \"Multi-layer solution based deposition of dielectrics for advanced substrate architectures\" (US-11508636). https://patentable.app/patents/US-11508636","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508636","json":"https://patentable.app/api/llm-context/US-11508636","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:35:59.313Z"}