{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508639","patent":{"patent_number":"US-11508639","title":"System in package (SiP) semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-06-30T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor package includes an interconnect structure having a first surface and a second surface opposing the first surface, and including a redistribution pattern and a vertical connection conductor, a first semiconductor chip disposed for a first inactive surface to oppose the first surface, a second semiconductor chip disposed on the first surface of the interconnect structure and disposed for the second inactive surface to oppose the first surface; a first encapsulant encapsulating the first and second semiconductor chips, a backside wiring layer disposed on the first encapsulant, a wiring structure connecting the redistribution pattern to the backside wiring layer, a heat dissipation member disposed on the second surface and connected to the vertical connection conductor."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System in package (SiP) semiconductor package","description":"A semiconductor package includes an interconnect structure having a first surface and a second surface opposing the first surface, and including a redistribution pattern and a vertical connection cond","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508639","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508639","citation_suggestion":"Patentable. \"System in package (SiP) semiconductor package\" (US-11508639). https://patentable.app/patents/US-11508639","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508639","json":"https://patentable.app/api/llm-context/US-11508639","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:37:50.287Z"}