{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508648","patent":{"patent_number":"US-11508648","title":"Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards","assignee":null,"inventors":[],"filing_date":"2018-06-29T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Techniques directed to forming and using coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards are described. One technique includes forming a substrate (205) comprising: first and second interconnect pads (213A, 213B) in or on a build-up layer (203); and first and second interconnects (211A, 211B) on the first and second interconnect pads (213A, 213B). The first interconnect pad (213A) can be located at a lower position than the second interconnect pad (213B) with regard to a z-position. The techniques described herein can assist with minimizing or eliminating solder ball bridge defects (SBBDs) that may be creating during performance of coupling technique (e.g., a reflow process, etc.)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards","description":"Techniques directed to forming and using coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards are described. One technique includes forming a substrate (205) compr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508648","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508648","citation_suggestion":"Patentable. \"Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards\" (US-11508648). https://patentable.app/patents/US-11508648","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508648","json":"https://patentable.app/api/llm-context/US-11508648","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:55:01.888Z"}