{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508652","patent":{"patent_number":"US-11508652","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-12-02T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, and a plurality of underfills between the package substrate and the semiconductor chip. The package substrate includes a trench formed in the package substrate and a plurality of dams on both sides of the trench, respectively. The top surfaces of the plurality of dams may be positioned at a lower level than the bottom surface of the semiconductor chip in a cross-sectional view of the semiconductor package with the package substrate providing a base reference level."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, and a plurality of underfills between the package substrate and the semiconductor chip. The package","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508652","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508652","citation_suggestion":"Patentable. \"Semiconductor package\" (US-11508652). https://patentable.app/patents/US-11508652","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508652","json":"https://patentable.app/api/llm-context/US-11508652","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:17:20.849Z"}