{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508658","patent":{"patent_number":"US-11508658","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-04-01T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"The present disclosure provides a semiconductor device package. The semiconductor device package includes a semiconductor substrate having a first surface and a first optical coupler disposed on the first surface of the semiconductor substrate. The first optical coupler includes a first surface facing away from the first surface of the semiconductor substrate and a first lateral surface connected to the first surface of the first optical coupler. The first surface of the first optical coupler and the first lateral surface of the optical coupler define an angle greater than 90 degrees. A method of manufacturing a semiconductor device package is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"The present disclosure provides a semiconductor device package. The semiconductor device package includes a semiconductor substrate having a first surface and a first optical coupler disposed on the f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508658","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508658","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-11508658). https://patentable.app/patents/US-11508658","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508658","json":"https://patentable.app/api/llm-context/US-11508658","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:21:37.034Z"}