{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508671","patent":{"patent_number":"US-11508671","title":"Semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-09-09T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method thereof","description":"A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution str","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508671","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508671","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method thereof\" (US-11508671). https://patentable.app/patents/US-11508671","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508671","json":"https://patentable.app/api/llm-context/US-11508671","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:46:13.235Z"}