{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508676","patent":{"patent_number":"US-11508676","title":"Density-graded adhesion layer for conductors","assignee":null,"inventors":[],"filing_date":"2019-05-15T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Density-graded adhesion layers on conductive structures within a microelectronic package substrate are described. An example is a density-graded adhesion layer that includes a dense region proximate to a conductive structure that is surrounded by a less dense (or porous) region adjacent to an overlying dielectric layer. Providing such a graded adhesion layer can have a number of benefits, which can include providing both mechanical connections for improved adhesion with a surrounding dielectric layer and provide hermetic protection for the underlying conductive structure from corrosive species. The adhesion layer enables the conductive structure to maintain its as-formed smooth surface which in turn reduces insertion loss of signals transmitted through the conductive structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Density-graded adhesion layer for conductors","description":"Density-graded adhesion layers on conductive structures within a microelectronic package substrate are described. An example is a density-graded adhesion layer that includes a dense region proximate t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508676","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508676","citation_suggestion":"Patentable. \"Density-graded adhesion layer for conductors\" (US-11508676). https://patentable.app/patents/US-11508676","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508676","json":"https://patentable.app/api/llm-context/US-11508676","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:52:37.706Z"}