{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508680","patent":{"patent_number":"US-11508680","title":"Solder ball application for singular die","assignee":null,"inventors":[],"filing_date":"2020-11-13T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A method is provided. The method includes one or more of conditioning one or more die pads of a singular die, applying a nickel layer to the one or more die pads, applying a gold layer over the nickel layer, applying a solder paste over the gold layer, applying one or more solder balls to the solder paste, and mating the one or more solder balls to one or more bond pads of another die, a printed circuit board, or a substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder ball application for singular die","description":"A method is provided. The method includes one or more of conditioning one or more die pads of a singular die, applying a nickel layer to the one or more die pads, applying a gold layer over the nickel","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508680","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508680","citation_suggestion":"Patentable. \"Solder ball application for singular die\" (US-11508680). https://patentable.app/patents/US-11508680","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508680","json":"https://patentable.app/api/llm-context/US-11508680","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:45:27.355Z"}