{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508683","patent":{"patent_number":"US-11508683","title":"Semiconductor device with die bumps aligned with substrate balls","assignee":null,"inventors":[],"filing_date":"2019-06-17T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device is disclosed including a semiconductor die mounted on a substrate. The substrate includes a pattern of solder balls which is complementary and aligned to a pattern of solder bumps on the semiconductor die. These complementary and aligned patterns of solder balls and solder bumps minimize the lengths of current paths between the solder balls and solder bumps, and provide current paths between the solder balls and solder bumps of relatively uniform lengths."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with die bumps aligned with substrate balls","description":"A semiconductor device is disclosed including a semiconductor die mounted on a substrate. The substrate includes a pattern of solder balls which is complementary and aligned to a pattern of solder bum","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508683","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508683","citation_suggestion":"Patentable. \"Semiconductor device with die bumps aligned with substrate balls\" (US-11508683). https://patentable.app/patents/US-11508683","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508683","json":"https://patentable.app/api/llm-context/US-11508683","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:11:12.746Z"}