{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508690","patent":{"patent_number":"US-11508690","title":"Laser compression bonding device and method for semiconductor chip","assignee":null,"inventors":[],"filing_date":"2020-11-02T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Laser compression bonding device and method for semiconductor chip","description":"A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508690","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508690","citation_suggestion":"Patentable. \"Laser compression bonding device and method for semiconductor chip\" (US-11508690). https://patentable.app/patents/US-11508690","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508690","json":"https://patentable.app/api/llm-context/US-11508690","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T20:32:52.164Z"}