{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11508729","patent":{"patent_number":"US-11508729","title":"Semiconductor die with decoupling capacitor and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-09-24T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":18,"abstract":"The present application provides a semiconductor die with decoupling capacitors and a manufacturing method of the semiconductor die. The semiconductor die includes first bonding pads, second bonding pads, bond metals and decoupling capacitors. The first bonding pads are coupled to a power supply voltage. The second bonding pads are coupled to a reference voltage. The bond metals are disposed on central portions of the first and second bonding pads. The decoupling capacitors are disposed under the first and second bonding pads, and overlapped with peripheral portions of the first and second bonding pads. The decoupling capacitors are in parallel connection with one another. First terminals of the decoupling capacitors are electrically connected to the first bonding pads, and second terminals of the decoupling capacitors are electrically connected to the second bonding pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor die with decoupling capacitor and manufacturing method thereof","description":"The present application provides a semiconductor die with decoupling capacitors and a manufacturing method of the semiconductor die. The semiconductor die includes first bonding pads, second bonding p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11508729","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11508729","citation_suggestion":"Patentable. \"Semiconductor die with decoupling capacitor and manufacturing method thereof\" (US-11508729). https://patentable.app/patents/US-11508729","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11508729","json":"https://patentable.app/api/llm-context/US-11508729","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:22:33.523Z"}