{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11510311","patent":{"patent_number":"US-11510311","title":"Electronic component module and method for manufacturing electronic component module","assignee":null,"inventors":[],"filing_date":"2021-03-11T00:00:00.000Z","publication_date":"2022-11-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component module and method for manufacturing electronic component module","description":"An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11510311","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11510311","citation_suggestion":"Patentable. \"Electronic component module and method for manufacturing electronic component module\" (US-11510311). https://patentable.app/patents/US-11510311","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11510311","json":"https://patentable.app/api/llm-context/US-11510311","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:15:08.349Z"}