{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515225","patent":{"patent_number":"US-11515225","title":"Reconstituted wafer including mold material with recessed conductive feature","assignee":null,"inventors":[],"filing_date":"2020-09-10T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A system and method. The system may include an integrated circuit (IC) die having two faces and sides. The system may further include mold material surrounding at least the sides of the IC die. The system may further include a redistribution layer and signal pads. The redistribution layer may be positioned between (a) the signal pads and (b) the mold material and the IC die. The redistribution layer may have conductive paths at least connecting the IC die and at least some of the signal pads. A surface of the mold material may abut the redistribution layer. The surface of the mold material may include at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Reconstituted wafer including mold material with recessed conductive feature","description":"A system and method. The system may include an integrated circuit (IC) die having two faces and sides. The system may further include mold material surrounding at least the sides of the IC die. The sy","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515225","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515225","citation_suggestion":"Patentable. \"Reconstituted wafer including mold material with recessed conductive feature\" (US-11515225). https://patentable.app/patents/US-11515225","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515225","json":"https://patentable.app/api/llm-context/US-11515225","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:47:31.809Z"}