{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515227","patent":{"patent_number":"US-11515227","title":"Semiconductor die including edge ring structures and methods for making the same","assignee":null,"inventors":[],"filing_date":"2020-10-05T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"Semiconductor devices laterally surrounded by at least one dielectric material portion are formed over a substrate. At least one edge seal ring structure is formed around the semiconductor devices and the at least one dielectric material portion. One or more of the at least one edge seal ring structure has a horizontal cross-sectional profile that includes laterally-extending regions that extend laterally with a uniform width between an inner sidewall and an outer sidewall, and notch regions connecting neighboring pairs of the laterally-extending regions and having a greater width than the uniform width. Cavities in the laterally-extending regions are connected to cavities in the notch regions to allow outgassing from the material of the at least one edge seal ring structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor die including edge ring structures and methods for making the same","description":"Semiconductor devices laterally surrounded by at least one dielectric material portion are formed over a substrate. At least one edge seal ring structure is formed around the semiconductor devices and","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515227","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515227","citation_suggestion":"Patentable. \"Semiconductor die including edge ring structures and methods for making the same\" (US-11515227). https://patentable.app/patents/US-11515227","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515227","json":"https://patentable.app/api/llm-context/US-11515227","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:37:29.774Z"}