{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515258","patent":{"patent_number":"US-11515258","title":"Package substrate and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-09-21T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A method for manufacturing a package substrate, includes: providing a glass frame having a through hole and a chip embedding cavity; fixing an electronic component in the chip embedding cavity; coating a dielectric layer to an upper surface of the glass frame, the through hole and the chip embedding cavity and curing the dielectric layer; photoetching the dielectric layer to form an opening window arranged above the through hole; depositing metal through the opening window and patterning the metal to form a metal pillar and a circuit layer, the metal pillar passing through the through hole, the circuit layer being arranged on the upper surface and/or a lower surface of the glass frame and being connected to the electronic component and the metal pillar; forming a solder mask on a surface of the circuit layer, patterning the solder mask to form a pad connected to the circuit layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate and manufacturing method thereof","description":"A method for manufacturing a package substrate, includes: providing a glass frame having a through hole and a chip embedding cavity; fixing an electronic component in the chip embedding cavity; coatin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515258","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515258","citation_suggestion":"Patentable. \"Package substrate and manufacturing method thereof\" (US-11515258). https://patentable.app/patents/US-11515258","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515258","json":"https://patentable.app/api/llm-context/US-11515258","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:29:45.071Z"}