{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515263","patent":{"patent_number":"US-11515263","title":"Method of producing laser-marked silicon wafer and laser-marked silicon wafer","assignee":null,"inventors":[],"filing_date":"2019-09-06T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A method of producing a silicon wafer includes: a laser mark printing step of printing a laser mark having a plurality of dots on a silicon wafer; an etching step of performing etching on at least a laser-mark printed region in a surface of the silicon wafer; and a polishing step of performing polishing on both surfaces of the silicon wafer having been subjected to the etching step. In the laser mark printing step, each of the plurality of dots is formed by a first step of irradiating a predetermined position on a periphery of the silicon wafer with laser light of a first beam diameter thereby forming a first portion of the dot and a second step of irradiating the predetermined position with laser light of a second beam diameter that is smaller than the first beam diameter thereby forming a second portion of the dot."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of producing laser-marked silicon wafer and laser-marked silicon wafer","description":"A method of producing a silicon wafer includes: a laser mark printing step of printing a laser mark having a plurality of dots on a silicon wafer; an etching step of performing etching on at least a l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515263","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515263","citation_suggestion":"Patentable. \"Method of producing laser-marked silicon wafer and laser-marked silicon wafer\" (US-11515263). https://patentable.app/patents/US-11515263","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515263","json":"https://patentable.app/api/llm-context/US-11515263","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:08.592Z"}