{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515269","patent":{"patent_number":"US-11515269","title":"Semiconductor packaging structure having antenna module","assignee":null,"inventors":[],"filing_date":"2018-12-05T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A semiconductor packaging structure includes: a substrate, a redistribution layer having one conductive plugs, metal bumps disposed on the redistribution layer, and electrically connected with the redistribution layer including the conductive plug; a semiconductor chip over the redistribution layer and aligned to and electrically connected with the conductive plug; an underfill layer filling a gap between the redistribution layer and the semiconductor chip and the conductive plugs; a polymer layer on the redistribution layer, over the plurality of metal bumps, the underfill layer and the semiconductor chip, exposing only top parts of the plurality of metal bumps and top part of the semiconductor chip; and an antenna module disposed on the second surface of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging structure having antenna module","description":"A semiconductor packaging structure includes: a substrate, a redistribution layer having one conductive plugs, metal bumps disposed on the redistribution layer, and electrically connected with the red","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515269","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515269","citation_suggestion":"Patentable. \"Semiconductor packaging structure having antenna module\" (US-11515269). https://patentable.app/patents/US-11515269","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515269","json":"https://patentable.app/api/llm-context/US-11515269","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:31:21.970Z"}