{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515270","patent":{"patent_number":"US-11515270","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-10-09T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An antenna package includes a conductive layer, an interconnection structure and an antenna. The interconnection structure is disposed on the conductive layer. The interconnection structure includes a conductive via and a first package body. The conductive via has a first surface facing the conductive layer, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The first package body covers the lateral surface of the conductive via and exposes the first surface and the second surface of the conductive via. The first package body is spaced apart from the conductive layer. The antenna is electrically connected to the second surface of the conductive via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"An antenna package includes a conductive layer, an interconnection structure and an antenna. The interconnection structure is disposed on the conductive layer. The interconnection structure includes a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515270","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515270","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-11515270). https://patentable.app/patents/US-11515270","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515270","json":"https://patentable.app/api/llm-context/US-11515270","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:22:59.839Z"}