{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515271","patent":{"patent_number":"US-11515271","title":"Electronic device including wire on side surface of substrate and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2021-01-27T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacturing an electronic device is provided, wherein the method includes the following steps. A first substrate is provided, wherein the first substrate has a top surface and a side surface. A first wire is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate, and the auxiliary bonding pad contacts the first wire. A second wire is formed on the side surface of the first substrate, and the second wire contacts the auxiliary bonding pad. The second wire and the auxiliary bonding pad include at least one same material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic device including wire on side surface of substrate and manufacturing method thereof","description":"A method of manufacturing an electronic device is provided, wherein the method includes the following steps. A first substrate is provided, wherein the first substrate has a top surface and a side sur","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515271","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515271","citation_suggestion":"Patentable. \"Electronic device including wire on side surface of substrate and manufacturing method thereof\" (US-11515271). https://patentable.app/patents/US-11515271","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515271","json":"https://patentable.app/api/llm-context/US-11515271","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:36:24.088Z"}