{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11515276","patent":{"patent_number":"US-11515276","title":"Integrated circuit, package structure, and manufacturing method of package structure","assignee":null,"inventors":[],"filing_date":"2020-08-30T00:00:00.000Z","publication_date":"2022-11-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit includes a semiconductor substrate, contact pads, testing pads, conductive posts, and dummy posts. The contact pads and the testing pads are distributed over the semiconductor substrate. The conductive posts are disposed on the contact pads. The dummy posts are disposed on the testing pads. A height of the conductive posts is greater than a height of the dummy posts."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit, package structure, and manufacturing method of package structure","description":"An integrated circuit includes a semiconductor substrate, contact pads, testing pads, conductive posts, and dummy posts. The contact pads and the testing pads are distributed over the semiconductor su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11515276","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11515276","citation_suggestion":"Patentable. \"Integrated circuit, package structure, and manufacturing method of package structure\" (US-11515276). https://patentable.app/patents/US-11515276","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11515276","json":"https://patentable.app/api/llm-context/US-11515276","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:24:04.225Z"}