{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11521934","patent":{"patent_number":"US-11521934","title":"Semiconductor package including interposer and method of manufacturing the semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-01-15T00:00:00.000Z","publication_date":"2022-12-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package comprises a package substrate, a semiconductor chip on the package substrate, and an interposer substrate on the semiconductor chip. The interposer substrate comprises a first surface facing the semiconductor chip and a trench in the first surface, the trench vertically overlapping the semiconductor chip. An insulating filler is provided between the semiconductor chip and the interposer substrate, and at least partially fills the trench of the interposer substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including interposer and method of manufacturing the semiconductor package","description":"A semiconductor package comprises a package substrate, a semiconductor chip on the package substrate, and an interposer substrate on the semiconductor chip. The interposer substrate comprises a first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11521934","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11521934","citation_suggestion":"Patentable. \"Semiconductor package including interposer and method of manufacturing the semiconductor package\" (US-11521934). https://patentable.app/patents/US-11521934","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11521934","json":"https://patentable.app/api/llm-context/US-11521934","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:36:51.707Z"}