{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11521937","patent":{"patent_number":"US-11521937","title":"Package structures with built-in EMI shielding","assignee":null,"inventors":[],"filing_date":"2020-11-16T00:00:00.000Z","publication_date":"2022-12-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure relates to thin-form-factor semiconductor packages with integrated electromagnetic interference (“EMI”) shields and methods for forming the same. The packages described herein may be utilized to form high-density semiconductor devices. In certain embodiments, a silicon substrate is laser ablated to include one or more cavities and a plurality of vias surrounding the cavities. One or more semiconductor dies may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. A plurality of conductive interconnections are formed within the vias and may have contact points redistributed to desired surfaces of the die-embedded substrate assembly. Thereafter, an EMI shield is plated onto a surface of the die-embedded substrate assembly and connected to ground by at least one of the one or more conductive interconnections. The die-embedded substrate assembly may then be singulated and/or integrated with another semiconductor device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structures with built-in EMI shielding","description":"The present disclosure relates to thin-form-factor semiconductor packages with integrated electromagnetic interference (“EMI”) shields and methods for forming the same. The packages described herein m","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11521937","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11521937","citation_suggestion":"Patentable. \"Package structures with built-in EMI shielding\" (US-11521937). https://patentable.app/patents/US-11521937","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11521937","json":"https://patentable.app/api/llm-context/US-11521937","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:04:29.302Z"}