{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11521947","patent":{"patent_number":"US-11521947","title":"Space efficient flip chip joint design","assignee":null,"inventors":[],"filing_date":"2021-07-14T00:00:00.000Z","publication_date":"2022-12-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An apparatus includes an Integrated Circuit (IC). A first pillar includes a first end and a second end. The first end is connected to the IC and the second end includes a first attachment point collinear with a first central axis of the first pillar. The first attachment point includes a first solder volume capacity. A second pillar includes a third end and a fourth end. The third end is connected to the IC and the fourth end includes a second attachment point disposed on a side of the second pillar facing the first pillar. The second attachment point includes a second solder volume capacity being less than the first solder volume capacity. A first distance between the first end and the second end is less than a second distance between the third end and the fourth end."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Space efficient flip chip joint design","description":"An apparatus includes an Integrated Circuit (IC). A first pillar includes a first end and a second end. The first end is connected to the IC and the second end includes a first attachment point collin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11521947","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11521947","citation_suggestion":"Patentable. \"Space efficient flip chip joint design\" (US-11521947). https://patentable.app/patents/US-11521947","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11521947","json":"https://patentable.app/api/llm-context/US-11521947","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:46:17.383Z"}