{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11521949","patent":{"patent_number":"US-11521949","title":"Wire bonding apparatus","assignee":null,"inventors":[],"filing_date":"2021-03-05T00:00:00.000Z","publication_date":"2022-12-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wire bonding apparatus","description":"Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a seco","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11521949","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11521949","citation_suggestion":"Patentable. \"Wire bonding apparatus\" (US-11521949). https://patentable.app/patents/US-11521949","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11521949","json":"https://patentable.app/api/llm-context/US-11521949","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:00:22.471Z"}