{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11525970","patent":{"patent_number":"US-11525970","title":"Microelectronic package communication using radio interfaces connected through wiring","assignee":null,"inventors":[],"filing_date":"2020-10-28T00:00:00.000Z","publication_date":"2022-12-13T00:00:00.000Z","cpc_codes":["G06F","G06F","H04B","H04B","H04M"],"num_claims":16,"abstract":"Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microelectronic package communication using radio interfaces connected through wiring","description":"Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11525970","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11525970","citation_suggestion":"Patentable. \"Microelectronic package communication using radio interfaces connected through wiring\" (US-11525970). https://patentable.app/patents/US-11525970","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11525970","json":"https://patentable.app/api/llm-context/US-11525970","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:46.217Z"}