{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11527509","patent":{"patent_number":"US-11527509","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-06-30T00:00:00.000Z","publication_date":"2022-12-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package including a first semiconductor chip including a first semiconductor layer having a first forward surface having a first integrated circuit thereon and a first rear surface and a plurality of first through vias electrically connected to the first integrated circuit and including at least first and second groups of first through vias, a second semiconductor chip including a second integrated circuit electrically connected to the first group of first through vias, and a third semiconductor chip including third through vias electrically connected to the second group of first through vias, wherein the first group of first through vias transfer input/output signals of the first integrated circuit, and the second group of first through vias transfer power to the first integrated circuit, may be provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package including a first semiconductor chip including a first semiconductor layer having a first forward surface having a first integrated circuit thereon and a first rear surface and","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11527509","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11527509","citation_suggestion":"Patentable. \"Semiconductor package\" (US-11527509). https://patentable.app/patents/US-11527509","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11527509","json":"https://patentable.app/api/llm-context/US-11527509","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:24:39.574Z"}