{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11527696","patent":{"patent_number":"US-11527696","title":"Low footprint resonator in flip chip geometry","assignee":null,"inventors":[],"filing_date":"2017-10-05T00:00:00.000Z","publication_date":"2022-12-13T00:00:00.000Z","cpc_codes":["G06N","G06N"],"num_claims":13,"abstract":"A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Low footprint resonator in flip chip geometry","description":"A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the princip","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11527696","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11527696","citation_suggestion":"Patentable. \"Low footprint resonator in flip chip geometry\" (US-11527696). https://patentable.app/patents/US-11527696","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11527696","json":"https://patentable.app/api/llm-context/US-11527696","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:30:51.468Z"}