{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11529700","patent":{"patent_number":"US-11529700","title":"Systems and methods for laser dicing of bonded structures","assignee":null,"inventors":[],"filing_date":"2019-08-16T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":20,"abstract":"Embodiments of systems and methods for dicing a bonded structure are provided. A method includes the following operations. First, a scan pattern can be determined for forming a series of ablation structures in the bonded structure. Relative positions between the series of ablation structures and a bonding interface of the bonded structure can then be determined. The bonding surface may be between a first wafer and a second wafer. At least one of one or more focal planes or a depth of focus of a laser beam may be determined based on the relative positions between the series of ablation structures and the bonding interface. Further, the laser beam may be determined. The laser beam has a series of pulsed lasers. Further, the laser beam may be moved in the bonded structure according to the scan pattern to form the series of ablation structures in the bonded structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems and methods for laser dicing of bonded structures","description":"Embodiments of systems and methods for dicing a bonded structure are provided. A method includes the following operations. First, a scan pattern can be determined for forming a series of ablation stru","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11529700","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11529700","citation_suggestion":"Patentable. \"Systems and methods for laser dicing of bonded structures\" (US-11529700). https://patentable.app/patents/US-11529700","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11529700","json":"https://patentable.app/api/llm-context/US-11529700","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:14:00.624Z"}