{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11532328","patent":{"patent_number":"US-11532328","title":"Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus","assignee":null,"inventors":[],"filing_date":"2019-04-04T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["G11B","H01L","H01L","H01L"],"num_claims":20,"abstract":"A multi-curing apparatus includes an actuator, a first chamber including a first energy source head, a second chamber including a second energy source head, a first driver including a first rotation transmission gear gear-engaged with the actuator, and a first driving gear gear-engaged with the first chamber. The apparatus further includes a second driver including a second rotation transmission gear gear-engaged with the actuator, and a second driving gear gear-engaged with the second chamber. The apparatus aligns a position of the first chamber with reference to a position of the second chamber while the first rotation transmission gear, the second rotation transmission gear, and the second driving gear are fixed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus","description":"A multi-curing apparatus includes an actuator, a first chamber including a first energy source head, a second chamber including a second energy source head, a first driver including a first rotation t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11532328","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11532328","citation_suggestion":"Patentable. \"Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus\" (US-11532328). https://patentable.app/patents/US-11532328","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11532328","json":"https://patentable.app/api/llm-context/US-11532328","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T19:50:01.555Z"}