{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11532489","patent":{"patent_number":"US-11532489","title":"Pillared cavity down MIS-SiP","assignee":null,"inventors":[],"filing_date":"2021-06-11T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Pillared cavity down MIS-SiP","description":"A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11532489","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11532489","citation_suggestion":"Patentable. \"Pillared cavity down MIS-SiP\" (US-11532489). https://patentable.app/patents/US-11532489","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11532489","json":"https://patentable.app/api/llm-context/US-11532489","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:19:08.764Z"}