{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11532535","patent":{"patent_number":"US-11532535","title":"Semiconductor die package with thermal management features and method for forming the same","assignee":null,"inventors":[],"filing_date":"2021-04-14T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, and a first semiconductor die and a second semiconductor die disposed thereon. A ring structure is attached to the package substrate and surrounds the semiconductor dies. A lid structure is attached to the ring structure and disposed over the semiconductor dies, and has an opening exposing the second semiconductor die. A heat sink is disposed over the lid structure and has a portion extending into the opening of the lid structure. A first thermal interface material (TIM) layer is interposed between the lid structure and the first semiconductor die. A second TIM layer is interposed between the extending portion of the heat sink and the second semiconductor die. The first TIM layer has a thermal conductivity higher than the thermal conductivity of the second TIM layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor die package with thermal management features and method for forming the same","description":"A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, and a first semiconductor die and a second semiconductor die disp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11532535","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11532535","citation_suggestion":"Patentable. \"Semiconductor die package with thermal management features and method for forming the same\" (US-11532535). https://patentable.app/patents/US-11532535","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11532535","json":"https://patentable.app/api/llm-context/US-11532535","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:43:08.885Z"}