{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11532580","patent":{"patent_number":"US-11532580","title":"Interconnect structure, semiconductor structure including interconnect structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2020-05-26T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An interconnect structure includes a plurality of first pads, a plurality of second pads, a plurality of first conductive lines in a first layer, a plurality of second conductive lines in a second layer, and a plurality of nth conductive lines in an nth layer. The first pads and the second pads respectively are grouped into a first, a second and an nth group. Each of the first pads in first group is connected to one of the second pads in the first group by one of the first conductive lines. Each of the first pads in the second group is connected to one of the second pads in the second group by one of the second conductive lines. Each of the first pads in the nth group is connected to one of the second pads in the nth group by one of the nth conductive lines."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure, semiconductor structure including interconnect structure and method for forming the same","description":"An interconnect structure includes a plurality of first pads, a plurality of second pads, a plurality of first conductive lines in a first layer, a plurality of second conductive lines in a second lay","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11532580","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11532580","citation_suggestion":"Patentable. \"Interconnect structure, semiconductor structure including interconnect structure and method for forming the same\" (US-11532580). https://patentable.app/patents/US-11532580","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11532580","json":"https://patentable.app/api/llm-context/US-11532580","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:32:33.378Z"}