{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11532584","patent":{"patent_number":"US-11532584","title":"Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling","assignee":null,"inventors":[],"filing_date":"2020-11-16T00:00:00.000Z","publication_date":"2022-12-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Integrated circuit package substrates with high-density interconnect architecture for scaling high-density routing, as well as related structures, devices, and methods, are generally presented. More specifically, integrated circuit package substrates with fan out routing based on a high-density interconnect layer that may include pillars and vias, and integrated cavities for die attachment are presented. Additionally, integrated circuit package substrates with self-aligned pillars and vias formed on the high-density interconnect layer as well as related methods are presented."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling","description":"Integrated circuit package substrates with high-density interconnect architecture for scaling high-density routing, as well as related structures, devices, and methods, are generally presented. More s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11532584","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11532584","citation_suggestion":"Patentable. \"Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling\" (US-11532584). https://patentable.app/patents/US-11532584","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11532584","json":"https://patentable.app/api/llm-context/US-11532584","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:35:14.562Z"}