{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11935800","patent":{"patent_number":"US-11935800","title":"Compound metal lid for semiconductor chip package","assignee":null,"inventors":[],"filing_date":"2022-01-27T00:00:00.000Z","publication_date":"2024-03-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A compound metal lid for semiconductor chip package is provided. The compound metal lid includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes, and an upper opening. The riveting holes penetrate through the first frame body and are distributed symmetrically on the first frame body. The upper opening is formed at an inner part of the first frame body, and the riveting holes surround the upper opening. The second cover has a second frame body, a plurality of riveting protrusions, and a lower opening. The riveting protrusions are formed on the upper surface of the second frame body. The lower opening penetrates through the second frame body. The first cover is disposed on an upper surface of the second cover, and the riveting protrusions are correspondingly riveted in the riveting holes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Compound metal lid for semiconductor chip package","description":"A compound metal lid for semiconductor chip package is provided. The compound metal lid includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11935800","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11935800","citation_suggestion":"Patentable. \"Compound metal lid for semiconductor chip package\" (US-11935800). https://patentable.app/patents/US-11935800","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11935800","json":"https://patentable.app/api/llm-context/US-11935800","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:20:44.786Z"}