{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11935821","patent":{"patent_number":"US-11935821","title":"Quad flat no-lead package with wettable flanges","assignee":null,"inventors":[],"filing_date":"2021-03-23T00:00:00.000Z","publication_date":"2024-03-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A device and method for fabrication thereof is provided which results in corrosion resistance of metal flanges (802) of a semiconductor package, such as a quad flat no-lead package (QFN). Using metal electroplating (such as electroplating of nickel (Ni) or nickel alloys on copper flanges of the QFN package), corrosion resistance for the flanges is provided using a process that allows an electric current to reach the entire backside of a substrate (102) to permit electroplating. In addition, the method may be used to directly connect a semiconductor die (202) to the metal substrate (102) of the package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Quad flat no-lead package with wettable flanges","description":"A device and method for fabrication thereof is provided which results in corrosion resistance of metal flanges (802) of a semiconductor package, such as a quad flat no-lead package (QFN). Using metal ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11935821","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11935821","citation_suggestion":"Patentable. \"Quad flat no-lead package with wettable flanges\" (US-11935821). https://patentable.app/patents/US-11935821","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11935821","json":"https://patentable.app/api/llm-context/US-11935821","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:22:17.191Z"}