{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11935824","patent":{"patent_number":"US-11935824","title":"Integrated circuit package module including a bonding system","assignee":null,"inventors":[],"filing_date":"2022-02-07T00:00:00.000Z","publication_date":"2024-03-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":26,"abstract":"An integrated circuit package module includes an integrated circuit package device including a contact element, and a bonding system formed on the integrated circuit package device. The bonding system includes a bonding system substrate and a bonding element formed in the bonding system substrate and conductively coupled to the contact element of the integrated circuit package device. The bonding element includes (a) a conduction component conductively connected to the contact element, the conduction component formed from a first metal having a first melting point, and (b) a bonding component formed from a second metal having a second melting point lower than the first melting point of the first metal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package module including a bonding system","description":"An integrated circuit package module includes an integrated circuit package device including a contact element, and a bonding system formed on the integrated circuit package device. The bonding system","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11935824","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11935824","citation_suggestion":"Patentable. \"Integrated circuit package module including a bonding system\" (US-11935824). https://patentable.app/patents/US-11935824","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11935824","json":"https://patentable.app/api/llm-context/US-11935824","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:58:59.653Z"}