{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11935877","patent":{"patent_number":"US-11935877","title":"Thermal management for package on package assembly","assignee":null,"inventors":[],"filing_date":"2021-06-22T00:00:00.000Z","publication_date":"2024-03-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Exemplary package on package (PoP) assemblies may include a substrate. The PoP assemblies may include a first package positioned on a first side of the substrate with a bottom surface of the first package facing the substrate. The PoP assemblies may include a second package positioned on a second side of the substrate with a top surface of the second package facing the substrate. The second side may be positioned opposite the first side. The PoP assemblies may include a conductive element that contacts one or both of a top surface and the bottom surface of the second package and extends to a position that is aligned with or above a top surface of the first package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal management for package on package assembly","description":"Exemplary package on package (PoP) assemblies may include a substrate. The PoP assemblies may include a first package positioned on a first side of the substrate with a bottom surface of the first pac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11935877","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11935877","citation_suggestion":"Patentable. \"Thermal management for package on package assembly\" (US-11935877). https://patentable.app/patents/US-11935877","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11935877","json":"https://patentable.app/api/llm-context/US-11935877","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:47:55.864Z"}