{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11937377","patent":{"patent_number":"US-11937377","title":"Circuit board preparation method","assignee":null,"inventors":[],"filing_date":"2021-10-18T00:00:00.000Z","publication_date":"2024-03-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":20,"abstract":"The main technical problem solved by the present disclosure is to provide a circuit board preparation method. The method includes: obtaining a to-be-processed plate comprising an insulating layer, a first copper layer, a second copper layer opposite to the first copper layer, a blind metalized hole, and a first tab facing the blind metalized hole; obtaining a white insulating material; laminating the white insulating material to a surface of the insulating layer, a surface of the first copper layer, a surface of the first tab, and a surface of the second copper layer to form a first white insulating medium layer and a second white insulating medium layer opposite to the first while insulating medium layer; and performing surface polishing for the first white insulating medium layer and grinding the first white insulating medium layer until the first tab is exposed to form a first white reflective layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit board preparation method","description":"The main technical problem solved by the present disclosure is to provide a circuit board preparation method. The method includes: obtaining a to-be-processed plate comprising an insulating layer, a f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11937377","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11937377","citation_suggestion":"Patentable. \"Circuit board preparation method\" (US-11937377). https://patentable.app/patents/US-11937377","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11937377","json":"https://patentable.app/api/llm-context/US-11937377","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:58:33.373Z"}